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Forecasting Growth in the Electronic Board Level Underfill and Encapsulation Material Market | #electronic Board Level Underfill and Encapsulation Material Market size # Electronic Board Level Underfill and Encapsulation Material Market analysis # Electronic Board Level Underfill and Encapsulation Material Market forecast

Forecasting Growth in the Electronic Board Level Underfill and Encapsulation Material Market

Forecasting Growth in the Electronic Board Level Underfill and Encapsulation Material Market

The global electronic board level underfill and encapsulation material market was valued at approximately US$ 386.3 million in the year 2024 and is expected to grow with a CAGR of 6.9% during the period 2024-2034.